COM-HPC and COM Express Type 6 modules feature Alder Lake-H mobile IoT processor


We’ve written about the new Intel Alder Lake IoT processors announced just before CES 2022, and the first on-board platforms are starting to appear with ADLink technology’s COM-HPC and COM Express Type 6 modules powered by the Alder 35 / 45W. Lake -H family of mobile IoT processors.

Express-ADP is a COM Express Basic Size Type 6 module, while COM-HPC-cADP is a COM-HPC Client Type Size B module. Both are designed for stationary, mobile and portable solutions with typical applications including ultrasound, test and measurement, industrial edge servers, machine vision, mammography, surgical robots, security or perimeter monitoring and access control.

Express-ADP

Besides the form factor, both modules will have very similar specifications. Here are the Express-ADP specifications:

  • SoC (12th Generation Intel Core Alder Lake-H)
    • 14-core Intel Core i7-12800HE (6P + 8E), 20-thread processor up to 4.6 GHz with 24MB cache, Intel Xe GPU, 45W TDP (35W cTDP)
    • 12-core Intel Core i5-12600HE (4P + 8E), 16-thread processor up to 4.5 GHz with 18MB cache, Intel Xe graphics processor, 45W TDP (35W cTDP)
    • 8-core Intel Core i3-12300HE (4P + 4E), 12-thread processor up to 4.3 GHz with 12MB cache, Intel UHD graphics, 45W TDP (35W cTDP)
  • Memory – Up to 64 GB (2x 32 GB) DDR5 non-ECC SO-DIMM memory, max. 4800MT / s
  • Storage
    • 32 or 16MB SPI Flash (TBC) for AMI UEFI Embedded BIOS with CMOS Backup
    • NVMe integrated storage SSD in place of PCIe 28-31 lanes (build option, project basis)
  • Video features
    • Hardware video encoding / decoding, up to 8K60 HEVC
    • DirectX 12, OpenGL 4.6, Vulkan 1.2, Mesa 3D support OneVPL
    • HDCP 2.3
    • Graphics hardware virtualization (SRIOV)
  • Networking – Up to 2 Intel i225 2.5GbE controllers, one with optional TSN support
  • SEMA board controller with voltage / current monitoring, support for power sequence debugging, AT / ATX mode control, logistics and forensic information, general purpose I2C, UART, GPIO,
    watchdog timer, fan control
  • 2x standard COM Express connectors
    • Storage – 2x SATA 3.0
    • I / F video
      • DDI 1/2/3 supporting DP 1.4a, HDMI 2.0b, DVI
      • VGA (build option) via DP-to-VGA IC (instead of DDI 3), max. resolution: 1920 × 1200 @ 60Hz
      • Single / dual channel 18/24 bit LVDS from eDP integrated circuit to LVDS, max. 920 × resolution[email protected] in dual mode
      • eDP (build option) instead of LVDS, 4 lanes, eDP 1.4b
      • DP alt. mode (See USB section)
    • Networking – 2 2.5 GbE interfaces
    • Usb
      • 4x USB 3.2 / 2.0 / 1.1 (USB 0-3), 4x USB 2.0 / 1.1 (USB 4-7)
      • Up to 2x USB4 instead of DDI 1/2, support alternative mode DP 1.4a by DP, Thunderbolt 4 compatible (to be confirmed)
    • PCIe
      • PCIe x8 Gen4, lanes 16-23, available for 45W (SKU cTDP 35W)
      • PCIe x4 Gen4, lanes 24-27
      • PCIe x4 Gen4, lanes 28-31
      • 5x PCIe x1 Gen3, lanes 0-3 (configurable as x1, x2, x4), lane 4 (additional PCIe x1, lanes 5-7 via PCIe switch, build option by project)
    • LPC bus (via ESPI-to-LPC bridge IC), SMBus (system), I2C (user), GP_SPI (TBC)
    • Serial – 2x UART ports with console redirection
    • 12x GPIO
  • Security – Infineon TOM 2.0
  • Debug Headers – Versatile 30 pin flat cable connector for use with DB30-x86 debug module providing BIOS POST LED, SEMA board controller access, BIOS SPI flash, test points power supply, debugging LEDs
  • Power source
    • ATX standard input: 12V ± 5% / 5Vsb ± 5%; or AT: 12V ± 5%
    • Large ATX input: 8.5-20V / 5Vsb ± 5%; or at: 8.5-20V
    • Management ACPI 5.0 compliant, Smart Battery (TBC) support
    • Power states C1-C6, S0, S1, S3, S4, S5, S5 ECO mode (Wake on USB S3 / S4, WOL S3 / S4 / S5) (to be confirmed)
    • ECO mode Support deep S5 mode to save power
  • Dimensions – 125 x 96 mm (PICMG COM.0: Rev 3.0 Type 6 Base size)
  • Temperature difference
    • Standard: 0 ° C to 60 ° C (storage: -20 ° C to 80 ° C)
    • Extremely robust: -40 ° C to 85 ° C (storage: -40 ° C to 85 ° C, to be confirmed, manufacturing option, selected references)
  • Humidity
    • 5-90% RH operating, non-condensing
    • Storage from 5 to 95% RH (and operation with compliant coating)
  • Shock and vibration
    • IEC 60068-2-64 and IEC-60068-2-27
    • MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D (to be confirmed)
    • HALT Thermal stress, vibration stress, thermal shock and combined test
Alder Lake-H COM Express Block Diagram
Express-ADP Block Diagram

The modules will support Windows 10 IOT Enterprise LTSC and the 64-bit Yocto Linux project, and 64-bit Ubuntu and VxWorks could become available, but that remains to be determined. A difference between the Express-ADP and COM-HPC-cADP modules is that the latter is also equipped with MIPI CSI and DSI interfaces. At least as stated in the specifications, since the block diagram does not show these …

COM-HPC Alder Lake-H
COM-HPC-cADP

There seems to have been some confusion since the modules are now released in Alder Lake-H processors, but the name and part of the specs show Alder Lake-P processors. I was told this was because the company was planning to release models with these as well. COM Express and HPC-COM starter kits will be offered.

As you might have guessed with the 3D renderings and the “TBC” references in the specs, ADLINK Express-ADP and COM-HPC-cADP are not yet available. More details can also be found on the respective product page for Express-ADP and COM-HPC-cADP. ADLINK was not the only company that introduced Alder Lake ‘IoT’ modules today, as I was writing this article, I received emails for various Alder Lake embedded systems including SECO CHPC-D80-CSA COM-HPC size A module, Veco ECX-3000 rugged computer with Alder Lake-S desktop IoT processor and 10 new computers on COM-HPC and COM Express modules with Alder Lake H-Series or S-Series processors by Congatec.


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